Heat sink for chip stacking applications

ABSTRACT

A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.

This application is a divisional application of application Ser. No.09/178,480 filed on Oct. 26, 1998, now U.S. Pat. No. 6,201,695, which ishereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the field of integrated circuits. Moreparticularly, the invention provides a heat sink for use with stacks ofintegrated circuits.

2. Description of the Related Art

As computer manufacturers have attempted to build more powerfulmachines, the use of chip stacks in modem computing applications hasbecome increasingly desirable. The term ‘chips’ used with the presentinvention is intended to include any packaged integrated circuit deviceincluding processing devices e.g. microprocessors etc., memory devicese.g. DRAMS, SRAMS, etc., and the like. In essence, a chip stackcomprises multiple integrated circuit packages which are stackedtogether (back-to-front or back-to-back). The chip stacks may beoriented either in face up position or in a side-to-side orientationwith chip edges down.

There are a number of advantages to the chip stack configuration overconventional single chip mounting arrangements. In particular, the chipstacks provide a more compact circuit arrangement for computers andother high speed electronic systems.

In addition, chip stacks particularly allow for more efficient use ofspace on circuit boards. The stack takes advantage of relatively lessvaluable space above the circuit board, while at the same time leaving asmall footprint on a circuit board or card, thereby increasing the spaceavailable for other components or chip stacks.

While there are numerous advantages to a stacked chip configuration,there are also associated problems. Specifically, larger and larger chipstacks create unique cooling problems. Because the chip stacks containmultiple chips, they generate more heat per unit volume, requiringgreater heat dissipation, while at the same time providing significantlysmaller surface areas which may be used as a heat sink. In view of thisproblem, the general response in the industry to the need for coolingchip-stacks has been to immerse the entire chip-stack in liquid or tooperate at greatly reduced power levels. This is often an unwelcomesolution because of technical concerns and also because of customer anduser preferences.

SUMMARY OF THE INVENTION

The present invention is generally directed at providing a relativelylow cost heat sink for dissipating heat generated within chip stacks(sometimes referred to as ‘chip cubes’, although a cubic structure isnot necessary). The invention provides a heat absorbing surface betweenat least a first and second chip within a chip stack which is connectedto a heat dissipating surface located outside the stack. According to apreferred embodiment, the heat sink includes one or more heat absorbingsections for respective insertion between chips within one or more chipstacks; a heat transfer section for transferring heat away from theabsorbing sections; and a heat dissipating section for commonlydissipating heat transferred from the heat absorbing sections.

These and other features and advantages of the invention will becomemore readily apparent from the following detailed description ofpreferred embodiments of the invention which are provided in connectionwith the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a heat sink of a first embodiment of theinvention.

FIG. 2 is a side view of the heat sink shown in FIG. 1.

FIG. 3 is a respective view of the heat sink of FIG. 1 secured to chipson a chip mounting surface.

FIG. 4 is a side view of the heat sink configuration shown in FIG. 3.

FIG. 5 is a side view of a first alternative heat sink configuration ofthe invention.

FIG. 6 is a side view of a second alternative heat sink configuration ofthe invention.

FIG. 7 is a side view of a third alternative heat sink configuration ofthe invention.

FIG. 8 is a perspective view of a preferred embodiment of the invention.

FIG. 9 is a perspective view of a fourth alternative embodiment of theinvention.

FIG. 10 is a perspective view of a fifth alternative embodiment of theinvention.

FIG. 11 is a perspective view of a sixth alternative embodiment of theinvention.

FIG. 12 is a perspective view of a second preferred embodiment of theinvention.

FIG. 13 is a side view of the second preferred embodiment shown in FIG.12.

FIG. 14 is a side view of an alternative embodiment of the secondpreferred embodiment shown in FIGS. 12 and 13.

FIG. 15 is a block diagram of a processor system in which the inventionmay be utilized.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Referring to FIG. 1, a planar heat sink 20 in accordance with apreferred embodiment of the invention will now be described. Heat sink20 is shown including three interconnected co-planar sections: a heatabsorbing section 22, a heat transfer section 24, and a heat dissipatingsection 26. FIG. 2 is a side view of heat sink 20 showing the relativelateral dimensions of the heat absorbing section 22, heat transfersection 24, and heat dissipating section 26.

Heat absorbing section 22 includes one or more fingers 22 a-22 h, eachof which is configured to be insertable between chips of a chip stack.Heat transfer section 24 includes heat transfer elements 24 a-24 h. Thefingers 22 a-22 h remove heat from the chip stack, which flows throughrespective heat transfer sections 24 a-24 h to dissipation section 26.Preferably, fingers 22 a-22 h are of a generally rectangular shape andsized to maximize heat absorption from a target chip's surface. As shownin FIG. 1, the width of the fingers 22 a-22 h is larger than the widthof the heat transfer elements 24 a-24 h. Alternatively, the width of thefingers 22 a-22 h may be the same, narrower or wider than the width ofthe heat transfer elements 24 a-24 h.

Preferably, heat sink 20 is comprised of a thermally conductive materialhaving a thermal rate of expansion approximately equal to the thermalexpansion rate of the stacked chips. In accordance with a preferredembodiment, heat sink 20 is comprised of a metal such as aluminum orcopper and may be easily stamped out of plate metal. In alternativeembodiments, it is possible for each of the three sections of heat sink20 to be formed of different materials in accordance with each section'sfunctional constraints.

With reference to FIGS. 3, 4, and 8, heat sink 20 is utilized by placingeach heat absorbing finger 22 a-22 h over a first layer chip 30 securedon a mounting surface 28 such as a plug-in board having edge connectors27. A second layer of chips is then secured over each heat absorbingfinger 22 a-22 h. Each finger 22 a-22 h may be affixed to the first andsecond layer chips 30, 32 using thermally conductivity enhancing mediumssuch as a thermal paste or epoxy. With reference to FIGS. 3 and 4, heatsink 20 is shown with each finger 22 a-22 h placed over a respectivefirst layer chip 30 with the heat transfer elements 24 a-24 h and heatdissipating section 26 extending away from the location of the chips 30,32. As shown in FIG. 8, a second layer of chips 32 is provided over thefirst layer of chips 30 with each respective finger 22 a-22 h positionedbetween each pair of first and second layer chips 30, 32. As shown, theheat transfer elements 24 a-24 h and heat dissipating section 26 areprovided outside the chip stack 33 created by the first and secondlayers of chips 30, 32. In an alternative embodiment, the heat transferelements 24 a-24 h may be provide so that at least a portion of the heattransfer elements 24 a-24 h lie within the chip stack 33.

With reference to FIGS. 3, 4, and 8, the heat transfer and heatdissipating sections 24, 26 are shown provided coplanar with heatabsorbing section 22. As shown in FIGS. 5-7, the heat transfer and heatdissipating sections 24, 26 may extend from the heat absorbing section22 at any angle necessary to take advantage of unused space above andbelow the chip stack. With reference to FIG. 5, an alternativeembodiment is shown in which heat dissipating section 26 is atapproximately a 45 degree angle to the heat absorbing section 22. Withreference to FIG. 6, an alternative embodiment is shown in which theheat dissipating section 26 is orthogonal to the heat absorbing section22. With reference to FIG. 7, an alternative embodiment is shown inwhich the heat dissipating section 26 is initially orthogonal to theheat absorbing section 22 and then is bent again be in parallel with theheat absorbing section 22 at a point above the heat absorbing section.

With reference to FIG. 9, an alternative embodiment is shown in whichthe heat dissipating section 26 is comprised of heat dissipating fins 34in order to further enhance heat dissipation by enlarging the surfacearea of section 26. With reference to FIG. 10, an additional alternativeembodiment is shown in which the heat dissipating section 26 is formedas corrugation waves 36 in order to increase surface area and heatdissipation.

With reference to FIG. 11, an alternative embodiment is shown in whichheat sink 27 includes a heat dissipating section 26 in thermal contactwith a pair of heat transfer sections 24, 25 and a pair of heatabsorbing sections 22, 23, which extend along both sides of heatdissipating section 26. As shown in FIG. 11, heat transfer sections 24and 25 respectively contain heat transfer elements 24 a-24 h and 25 a-25h, and heat absorbing sections 22 and 23 respectively contain heatabsorbing elements 22 a-22 h and 23 a-23 h.

With reference to FIGS. 12 and 13, a second preferred embodiment isshown in which a pair of planar heat sinks 37, 39 are used together todissipate heat from chip stacks 33, 35 positioned on each side ofmounting surface 28. Alternatively, as shown in FIG. 14, a singlecontinuous heat sink 41 may be used to dissipate heat from chip stacks33, 35 positioned on each side of mounting surface 28.

One particular environment in which the heat sink of the invention maybe used is within a memory module for a processor-based system. In thiscase, the integrated circuits 30, 32 may be integrated circuit memorydevices such as DRAMS, SRAMS, EEPROM, etc. and the mounting surface 28may be constructed as a plug-in board such as a SIMM (Single In-LineMemory Module), DIMM (Dual In-Line Memory Module), SO-SIMM (SmallOutline-Single In-Line Memory Module), SO-DIMM (Small Outline-DualIn-Line Memory Module), RIMM (Rambus In-line Memory Module) or otherplug-in module, for receipt in a system memory socket.

A typical processor-based system, which includes the present inventionformed as a memory module, is illustrated generally at 640 in FIG. 15. Aprocessor-based system typically includes a processor, which connectsthrough a bus structure with memory modules, which contain data andinstructions. The data in the memory modules is accessed duringoperation of the processor. This type of processor-based system is usedin general purpose computer systems and in other types of dedicatedprocessing systems, e.g. radio systems, television systems, GPS receiversystems, telephones and telephone systems to name a few.

Referring to FIG. 15, such a processor-based system generally comprisesa central processing unit (CPU) 644, e.g. microprocessor, thatcommunicates to at least one input/output (I/O) device 642 over a bus652. A second (I/O) device 646 is illustrated, but may not be necessarydepending upon the system requirements. The processor-based system 640also may include a static or dynamic random access memory (SRAM, DRAM)648 in the form of memory modules of the kind described and illustratedabove, a read only memory (ROM) 650 which may also be formed in the formof memory modules of the kind described above. The processor-basedsystem may also include peripheral devices such as a floppy disk drive654 and a compact disk (CD) ROM drive 656, which also communicate withCPU 644 over the bus 652. It must be noted that the exact architectureof the processor-based system 600 is not important and that anycombination of processor compatible devices may be incorporated into thesystem. Each of the memories 648 and 650 may be constructed as plug-inmodules employing a heat sink constructed in accordance with theteachings of the invention.

The above description and accompanying drawings are only illustrative ofpreferred embodiments, which can achieve and provide the features andadvantages of the present invention. It is not intended that theinvention be limited to the embodiments shown and described in detailherein. For instance, the present invention is described only withrespect to stack of two chips stacked vertically. Alternatively, thepresent invention may be used with any number of stacked chips, whichmay be stacked in a vertical, horizontal, or in side-by-side fashion.Accordingly, the invention is not limited by the foregoing descriptionbut is limited only by the spirit and scope of the appended claims.

What is claimed as new and desired to be protected by Letters Patent ofthe United States is:
 1. A method of removing heat from stackedintegrated circuits, said method comprising: providing at least one heatabsorbing section; said heat absorbing section having at least oneplanar extending element interposed between stacked integrated circuits;providing a heat dissipation section; and, providing a heat transfersection interconnecting said heat absorbing section and said heatdissipating section, said heat transfer section having at least one heattransfer element connected to a respective planar extending element. 2.The method of claim 1, wherein said heat dissipating section contains aplurality of outwardly extended fins.
 3. The method of claim 2, whereinsaid plurality of outwardly extending fins extend the length of saidheat dissipating section.
 4. The method of claim 1, wherein said heatdissipating section contains corrugations.
 5. The method of claim 4,wherein said corrugations extend along the length of said heatdissipating section.
 6. The method of claim 1, wherein said heatabsorbing section is comprised of a plurality of planar extendingelements each configured to be interposed between stacked integratedcircuits, and said heat transfer section is comprised of a plurality ofheat transfer elements respectively connected to said plurality ofplanar extending elements.
 7. The method of claim 6, wherein saidplurality of planar extending elements extend from opposite sides ofsaid heat dissipating section.
 8. The method of claim 7, wherein saidheat absorbing section is comprised of a thermally conductive materialhaving a thermal rate of expansion approximately equal to the thermalexpansion rate of the stacked integrated circuits.
 9. The method ofclaim 6, wherein at least one heat transfer element is the same width asat least one of said planar extending elements.
 10. The method of claim6, wherein at least one heat transfer element is narrower than at leastone of said planar extending elements.
 11. The method of claim 10,wherein at least one of said plurality of planar extending elements isrectangular.
 12. The method of claim 6, wherein said heat absorbingsection, said heat transfer section, and said heat dissipating sectionare coplanar.
 13. The method of claim 6, wherein said heat absorbingsection, said heat transfer section, and said heat dissipating sectionare not coplanar.
 14. The method of claim 13, wherein said heatdissipating section is orthogonal to said heat absorbing section. 15.The method of claim 6, wherein at least one of said heat transferelements is configured so that in use it is located outside said stackedintegrated circuits.
 16. The method of claim 6, wherein at least one ofsaid heat transfer elements is configured so that in use it is locatedwithin said stacked integrated circuits.
 17. A method for removing heatfrom a stacked integrated circuit, said method comprising: providing aheat sink having a first portion configured to be interposed between twostacked integrated circuits and a second portion connected to said firstportion for dissipating heat.
 18. The method of claim 17, wherein saidsecond portion includes a plurality of outwardly extended finsconfigured to remove heat from said heat sink.
 19. The method of claim17, wherein said second portion contains areas of corrugation.
 20. Themethod of claim 17, wherein said heat sink is comprised of a thermallyconductive material having a thermal rate of expansion approximatelyequal to the thermal expansion rate of the stacked integrated circuits.21. The method of claim 17, wherein said first portion is comprised of aplurality of rectangular elements.
 22. The method of claim 17, whereinsaid heat sink is substantially flat.
 23. The method of claim 17,wherein said heat sink is not substantially flat.
 24. The method ofclaim 17, wherein said heat sink is configured so that in use at leastof portion of said heat sink is located outside said stacked integratedcircuits.
 25. The method of claim 17, wherein said heat sink isconfigured so that in use at least of portion of said heat sink islocated within said stacked integrated circuits.